Icemax 2.1 is a major new update to the tool, targeted specifically toward providing a more integrated design flow for customers using Cadence’s Allegro Package Design environment.

“IC package design cycles are shrinking continuously, while the layouts are getting more and more complicated. Semiconductor companies worldwide are constantly looking for cost savings in their design flow to maintain their competitive edge. Our customers continue to realize significant return on investment due to the superior performance of Icemax compared to any other tool in the market today. Icemax 2.1 further strengthens Fluent’s partnership with customers by providing a smooth and seamless data transfer from their design environment to the extraction tool.” says Rajesh Nair, Icemax Product Manager.

As a member of the Cadence Connections Program, Fluent has access to Cadence software and applications notes, ensuring open collaboration that benefits mutual customers. Fluent has already integrated its thermal analysis products Icepak and Iceboard with the Allegro platform. The release of Icemax 2.1 further expands the interoperability of Fluent’s products in IC package design flows worldwide.