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| Best Practices for Forced Convection Simulations |
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Posted Wed January 16, 2013 @02:12PM
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The most common method for cooling electronics assemblies is best classified as forced convection cooling. The alternative classifications are natural convection (passive) cooling and radiative cooling (such as used in space-based applications). Forced convection cooling typically involves air being moved through a system by a fan, and the air removes the heat from the system via convection.
Best practices for each step in the simulation process will be discussed during the series; Part 1 will address:
- Air volume definition
- Appropriate boundary conditions
- Mesh requirements
- Treatment of fans
Specific examples will be used to visualize and demonstrate the steps.
This seminar is targeted to those either looking at or already performing thermal simulations of electronics assemblies.
This webinar is free, but registration is required to obtain log-in credentials:
- 10am (London) • 11am (Berlin/Paris) • 3:30pm (Bangalore) > Register
- 10am (Los Angeles) • 1pm (New York) > Register
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