Moldex3D-Mesh provides an advanced mesh generator for fast preparation of complex model geometries and supports various mesh types. Moldex3D TSV-Midplaner further reinforces its benefits and introduces new capabilities, highly reducing the time of shell mesh preparation. The automatic midplane mesh generator enables the creation of a high-quality midplane mesh for accurate simulations.
Common meshing problems, such as missing faces, poor joining of faces or inaccurate thickness results are eliminated.
With its interoperable and easy-to-use interface, the seamless work flow from design to meshing improves productivity and efficiency of shell part design and optimization.
“Moldex3D/Shell solvers are widely used in various industries. Moldex3D TSV-Midplaner is specifically developed to solve the chronic problems remaining in the shell meshing process.” said Dr. Venny Yang, President of CoreTech System, “Through partnership with TechnoStar, we are able to provide a more efficient solution to significantly reduce meshing difficulties for users.”
“TSV midplane extraction technology has been widely applied in the manufacturing industries, especially for automotive customers. We are glad to integrate with Moldex3D and open up a path for more CAE users to easily use this function,” said Masaru Tateishi, President of TechnoStar.
Moldex3D TSV-Midplaner is expected to greatly expand meshing capacity, increase users’ competitiveness and shorten product time-to-market. For pricing and more detailed product information, please contact your local Moldex3D representatives. Further technical information can also be found at www.moldex3d.com.
About CoreTech System Co., Ltd. (Moldex3D)
CoreTech System Co., Ltd. (Moldex3D) has been providing the professional CAE analysis solution "Moldex" series for the plastic injection molding industry since 1995, and the current product "Moldex3D" is marketed worldwide. Committed to providing advanced technologies and solution for industrial demands, CoreTech has extended their worldwide sales and service network to provide local, immediate, and professional service.
About TechnoStar Co., Ltd. (TechnoStar)
TechnoStar, founded by the recognized CAE expert and entrepreneur Masaru (Mars) Tateishi in 2002, develops, markets, and supports a CAE software suite under the name TSV-Solutions. Based on a legacy free breakthrough data structure and guided by customer requirements, TSV has been developed from day one to overcome the challenges and bottlenecks in simulation model generation, result visualization and collaborative engineering of today’s product development process. Customers include leading global automobile, heavy machinery, electric companies such as Ford, Nissan, Honda, Mazda, Dongfeng Auto, Fuji Xerox etc. TechnoStar is headquartered in Tokyo and operates an office in Beijing, China.