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Fluent Releases Icepak 4.2
Posted Thu October 20, 2005 @08:20PM
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News Fluent Inc., the world leader in computational fluid dynamics (CFD) software, releases version 4.2 of its Icepak™ electronics cooling design software. The newest version of Icepak incorporates optimization capabilities for thermal design of electronic systems. Design optimization obviates the need for trial-and-error simulations in determining the optimum parameters of a thermal design. The ease-of-use of Icepak's embedded optimization module coupled with its efficient gradient-based optimization algorithm enables the thermal design process to be completed in hours rather than days.

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Enhanced parametric capabilities including logic-based control enable complete exploration of the design space with a single Icepak model. Parametric capabilities include the option to turn on or turn off objects based on pre-selected criteria. Powerful post-processing capabilities like comprehensive user-defined post processing functions and reporting on multiple data sets allow for greatly speeding up the design process.

“Recently I have been using version 4.2 of the Icepak software and have realized several nice enhancements. Setting up various design variables and design constraints (limits) for specific design iterations has allowed my productivity to increase dramatically during the development phases of new product creation. As early as the conceptual feasibility stages to support newly forming product architectures, I have been able to “speed up” the optimization of heat-sink designs, fan sizing, component placements, as well as establishing key packaging design aspects that are influential to temperature results. By this end, I have been able to respond more efficiently to development team proposed design changes, and achieve a “real time” influence on product design development.” says Jim Jamra of C-COR Inc. Connecticut, USA.

In addition, Icepak 4.2 offers a mixed meshing capability where the user can use mixed tetrahedral and hexahedral meshes, a power table for easy entry of component powers, transient Joule heating capabilities, macros for a variety of uses including creation of DELPHI compact models of IC packages, accurate modeling of Thermo Electric Coolers (TECs) and many more features. Icepak 4.2 also allows you to create post-processing and reporting variables that can be used either during an exploration of the parametric design space or for tracking while performing design optimization.

Icepak 4.2 is available on UNIX, Windows, and Linux platforms. It is provided at no additional cost to all current Icepak users who have chosen to purchase upgrades along with their Icepak licenses. Icepak license fees depend on the number of seats purchased. Annual license fees include unlimited technical support.

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