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Heatsink Optimization Software Released
Posted Tue June 17, 2003 @08:45AM
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News Fluent Inc., world leader in computational fluid dynamics (CFD) software, and Qfinsoft Technology Inc. of Canada, announces the release of the latest version of the popular heat sink optimization software tool Qfin 3.0. This software is a part of the electronics cooling software suite from Fluent that includes Icepak 4.0 and Icepro 3.1. Qfin 3.0, an easy-to-use tool for designing optimized heat sinks, is sold exclusively by Fluent throughout the world. In the United States, Applied Thermal Technologies Inc., which is a sister company of Fluent, sells Qfin as a stand-alone product.

According to Dr. Jan Visser, President of Qfinsoft, Qfin has been developed as a heat sink design and optimization tool to cut the time and effort involved in designing optimized heat sinks. Along with a completely new design interface, a more advanced network solver that can solve multiple fans on the same heat sink, Qfins accuracy over a wide range of complex heat sink geometries has been improved.


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The dynamic parameterized mathematical optimization in Qfin 3.0 is a unique application of its kind. Optimization can now even be done with multiple objective functions. Heat sinks created in Qfin can be exported seamlessly into Fluent's system-wide electronics cooling software, Icepak, for greater design integration and shorter design cycles. Combined with the leading edge CFD technology provided by Icepak, and a well-qualified support team worldwide, electronics cooling solutions are now more efficient than ever before. In the future, we will work towards an even tighter integration between Icepak and Qfin.

Were glad to see Qfinsoft respond to the customer needs in advancing the capabilities of Qfin. The completely redesigned interface and ease of working with heat sink configurations combined with the speed of optimization makes this a valuable tool in the arsenal of thermal design engineers to meet the challenges of producing quick, reliable, and robust designs," adds Icepaks Global Business Manager Prabhu Sathyamurthy. A quick estimation of optimum heat sink characteristics cuts down the design time at the device, component, and system levels, and adds design effectiveness. By quickly evaluating a number of design options, engineers can deliver more reliable designs in a shorter period of time. Our mission, Sathyamurthy continues, is to provide the best suite of products to address the critical needs of the electronics industry.

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