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New Thermal Analysis Tool with 3D CFD
Posted Tue October 22, 2002 @09:24AM
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News TASPCB is the revolutionary new thermal analysis software for printed circuit boards from Harvard Thermal. Increasing board densities and higher power dissipation require an accurate and thorough thermal analysis to insure the reliability of today's electronics. TASPCB enables companies to quickly and easily analyze the thermal design of their boards and address thermal management issues early in the design stage; dramatically reducing the time and expense of building prototypes.

TASPCB imports all the data from industry recognized ECAD tools and generates an accurate representation of the board including traces, vias, power and ground planes and true board shape. Using SmartMapping technology, TASPCB cross references the data to the built-in component library to generate accurate 3D representations of the components. Predicting heat transfer and air flow across the board is accomplished by the integrated CFD solver developed by Harvard Thermal. The air and the board are automatically and independently meshed for optimum solution of each domain and optimum solution speed. Results can be viewed graphically or in tabular format to identify over temperature-components.  Components can be simply drag and dropped and heat sinks added to solve problems. TASPCB models can be exported to TAS, Ansys, NASTRAN, and FEMAP for system level analysis.

Harvard Thermal is located in Harvard, Massachusetts.  The company provides cutting edge software solutions for thermal management as well as thermal, structural and fluid flow consulting services.  For additional information on Harvard Thermal or the other software products and services they offer, please visit their web site at www.HarvardThermal.com or call (978) 772-3800.


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