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Optimizing an Electromechanical Device with Multidimensional Analysis Software
Posted Mon April 01, 2013 @01:11PM
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Announcements Tecplot and Integrated Engineering Software will host Optimizing an Electromechanical Device with Multidimensional Analysis Software on April 4th.

This joint webinar will use the latest features in Tecplot, Inc.’s multidimensional analysis software (Tecplot Chorus) to help the researcher visualize the interplay of multiple parameters from Integrated Engineering Software’s field analysis programs.

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There are a number of sophisticated routines for solving multidimensional constrained optimization problems (such as sequential quadratic programming, trust region reflective algorithms and various stochastic routines) which characteristically leave the researcher without a good physical feel for the critical parameters. As a result, the designer is forced to rely on intuition and is left with the uneasy feeling that something has been left out.

This webinar will show you how to gain a visual feel of the interplay of multiple parameters and objectives. Among the benefits gained is the ability to easily isolate outliers, variables of secondary interest, and the effects of slight variations on the critical objective.

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