Designing Energy Efficient Data Centers: The National Science Foundation Industry University Cooperative Research Center (IUCRC) on Energy Smart Electronic Systems (ES2)
Alfonso Ortega, Villanova University
Mobile Device Technical Challenges Leading Innovation
Steve Bezuk, Ph.D., Senior Director, Engineering, Qualcomm CDMA Technologies
Microfluidic Thermal Management and Thermal-Electronic Co-Design for Chip Stacks
Dr. Avram Bar-Cohen, Distinguished University Professor, University of Maryland, USA
Dr. Ankur Srivastava, Associate Professor, University of Maryland, USA.
Multi-Die Integration – Drivers and Challenges
Ivor Barber, Director of Packaging, Xilinx
The Higgs Boson: What do we know?
Prof. Marjorie Shapiro, University of California, Berkeley