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LED Thermal Characterization Made Easy
Posted Mon July 18, 2011 @10:15AM
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Announcements Mentor Graphics will host LED Thermal Characterization Made Easy on July 26, 2011 at 10am London / 11am Europe / 2pm US-Eastern.

The webinar will introduce the principles of thermal transient testing as a general method of semiconductor package characterization by means of physical measurement.

Sponsor CFD Review

The features of the T3Ster system, the Mentor Graphics MicReD implementation of this test by means of the JEDEC JESD51-1 static test method will be discussed in detail along with the concept of thermal impedances (driving point impedance, transfer impedances).

The unique thermal transient results, post-processing technology resulting in structure functions, and dynamic compact thermal models of packages will also be covered. The new de facto standard of the junction-to-case thermal resistance (RthJC) measurement of power semiconductors such as power LEDs based on the so called dual interface method will be shown. This method is also based on structure functions and it is likely to become a new JEDEC standard.

What You Will Learn

  • How to measure thermal characteristics of power LEDs, LED lines and assemblies such as an RGB module
  • How to perform structural analysis of power LED packages using structure functions
  • How to generate compact thermal models of power LED packages to be used e.g. in CFD simulation
  • How to perform measurement of the temperature dependence of light output metrics of LEDs

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