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Reducing PCB Re-Spins
Posted Wed February 10, 2010 @09:10AM
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Announcements Mentor Graphics would like to invite you to Reducing PCB Re-Spins on Wednesday February 24th 2010 at 1pm US/Eastern.

It is standard practice to develop electrical and mechanical constraints at a very early stage in the design of electronics and enforce them all the way through to shipping the product. Every bit as important, but less frequently practiced, is the development and enforcement of thermal constraints (ie, maximum allowable temperatures) in the design flow.

Sponsor CFD Review

Given the complexity and thermal densities of today's electronic products, failure to enforce thermal constraints concurrently with electrical and mechanical constraints is a risky strategy. The 'thermal bandaid' approach (ie, leaving all thermal re-design cycles until the end) can be extremely costly and time consuming.

This seminar will show you why and how to best incorporate thermal constraints into an existing design flow.

What You Will Learn

  • How to develop thermal constraints
  • How to incorporate thermal constraints into a design flow
  • Why late thermal fixes adversely affect the design flow
For more information and to register for this event, click here.

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