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Optimize Chassis, Venting and Airflow Design in Electronics Enclosures
Posted Tue September 01, 2009 @03:52PM
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Announcements During this complimentary 45-minute Mentor Graphics presentation, we will show you how simulation can help you optimize airflow and resolve heat transfer issues inside electronics enclosures.

Wednesday, September 16
11:00 am US/Pacific
Tuesday, September 17
10:00 am UK/London Time

Sponsor CFD Review

Optimizing airflow in and around electronics is a key area of concern regardless of project size: whether it's a 50,000 square foot data center, a high-powered board placed inside a computer or any other type of electronics device. Any change, however minute, to the chassis, layout and components can dramatically alter the thermal and flow behavior inside the electronics enclosure. Simulation is the key to ensuring that the right amount of natural or forced ventilation is delivered to the various components and in the most effective way possible.

If you are an engineer who has been tasked with answering your organization's thermal problems with electronics enclosures, you should attend this webinar. A wide range of topics will be discussed including:

  • Changing the chassis shape
  • Modifying the layout
  • Changing fans, heatsinks and guide vanes
  • Optimizing your design for manufacturability and cost

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