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2006 Icepak Summit
Posted Tue March 28, 2006 @04:34PM
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News The 2006 Icepak Summit will be held in conjunction with Fluent's 2006 CFD Summit May 22-23, 2006 at the Hyatt Regency in Monterey, CA. This event is for engineers and managers looking to share ideas on how to enhance the use of thermal modeling within their electronics cooling design processes.

Come and see the newest applications and approaches using Icepak, Icepro, Iceboard, Icechip, and Icewave. Learn about upcoming developments in these products, as well as new products that will be released in the coming months.


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