The International ANSYS Conference brings together engineers, analysts and management from all disciplines of CAE to learn about the future of engineering design simulation and analysis. Themed "A World of Simulation," this year's conference will showcase how global, forward-thinking companies have put engineering simulation at the forefront in producing innovative and successful products. The conference will demonstrate how ANSYS' vision and technology meet the ever-changing needs of users who demand integrated, automated, scalable and multidisciplinary tools. In addition, participants will have the opportunity to see and hear how ANSYS' next release will impact the industry, to try out the hands-on preview and to exchange ideas with ANSYS team members, industry experts and colleagues from companies throughout the world.
"Today, innovation is a critical element in business strategy. Our drive to advance engineering simulation for our valued user community places ANSYS at the technological forefront of such strategy. Over the years, technology has advanced significantly, and our expanding customer base continues to find new ways to use these tools to drive innovation in product development and design. We look forward to getting together with our customers at the conference to learn about their most recent innovations in the world of simulation technology," said Jim Cashman, president and CEO of ANSYS, Inc.
The 2006 International ANSYS Conference will feature dynamic keynote presentations, technical sessions, management sessions, ANSYS Solves topics (which provide an inside look at the latest ANSYS technologies and how this technology can be applied to help ensure success) and exhibitions.
Conference speakers will address how their leading organizations have created innovative solutions:
- Sophie Vandebroek, Ph.D., Chief Technology Officer and President, Xerox Innovation Group: exploring the unknown in product innovation (keynote address)
- James E. Cashman III, President and Chief Executive Officer, ANSYS, Inc.: perspectives on innovation
- Kyril Faenov, Director, High Performance Computing, Windows Server Group, Microsoft: product plans and roadmap
- John L. Gross, Ph.D., P.E., Research Structural Engineer, Building and Fire Research Laboratory, National Institute of Standards and Technology (NIST): investigating the World Trade Center Towers collapse
- Graham Hawkes, Ocean Engineer, Inventor and Founder, Hawkes Ocean Technologies: the birth of underwater flight
- Dale S. Preece, Ph.D., Distinguished Member of Technical Staff, Sandia National Laboratories: simulation in developing national security explosives
Technical sessions will detail how product development professionals in specific industries have deployed simulation technology in their design process: aerospace and aviation, automotive and transportation, biomechanics, chemical process and petroleum, civil engineering, computers and software, consumer products, education, electronics and electrical, MEMS, nuclear and power generation. Their success stories will show how the integrated ANSYS portfolio provides benefits critical to the engineering process.
Beyond the technical challenges it presents, the drive for innovation is greatly affected by the decisions managers make. The 2006 International ANSYS Conference will host a management track to outline best practices. Innovative organizations will discuss leveraging computer modeling, simulation tools and processes to stay ahead of the curve. In addition, managers will have the opportunity to network and share ideas with their peers. Main management session presenters include:
- Stefan H. Thomke, Ph.D., Professor of Business Administration, Harvard Business School: experimentation and breakthrough innovation
- Craig Vogel, Director, Center for Design Research and Innovation, University of Cincinnati: delivering value in the product development process
The World of Innovation Expo will be staged in the largest exhibit hall in the history of the conference. The David L. Lawrence Convention Center will host ANSYS, its most valued partners and other companies as they provide hands-on demos, literature and displays of their innovative products -- which all can contribute to further innovation in any company's design process. This year's new venue allows the opportunity for more space, more exhibitors (from hardware partners to CAD software developers to engineering consultants) and extended hours. One of the most popular elements of the exhibit hall has been the ANSYS hands-on area, and this year's content, breadth and size have increased greatly from previous events. In response to attendee feedback, the area has been expanded to accommodate an unprecedented number of users. Twice as many computers will be available for use -- courtesy of hardware sponsors AMD and Intel -- compared to the 2004 event. The hands-on area will provide attendees the opportunity to work with the full range of ANSYS software offerings, as well as preview the upcoming ANSYS release. In addition, experts in disciplines from nonlinear to fluid structure interaction (FSI) to computational fluid dynamics (CFD) to meshing will be available to consult informally on problem solving and best practices. Formal presentations will be staged in the area as well, providing another opportunity to learn about the latest technology from ANSYS, Inc.
Pre-conference training, which will be held prior to the conference on April 30 through May 1 at the Westin Convention Center Pittsburgh, will offer insight into ANSYS products for a variety of advanced analyses. Participants will receive instruction (in some cases hands-on) on topics ranging from advanced shell meshing to programming in ANSYS-APDL.
Accommodations for both the conference and pre-conference training are being provided by the Westin Convention Center Pittsburgh, which is connected to the 2006 International ANSYS Conference site. Visit http://www.ansys.com/conf2006 for more information and to register.
Sponsors of the 2006 International ANSYS Conference include: Platinum - Microsoft; Gold - Autodesk, Hewlett-Packard and Silicon Graphics, Inc.; as well as Silver - AMD, ATI, Dell, i*hydra, Intel and Moldflow.