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The Proper Mesh Can Dictate the Accuracy of Results

	Posted Thu October 08, 2015 @03:33PM
	Thermal and airflow simulation for electronics cooling thermal design applications presents unique challenges. Typical applications include many surfaces on which boundary layers form, e.g. tops of components, heatsink fins, boards, etc. The most accurate prediction of the pressure and temperature gradients associated with these surfaces is provided by Computational Fluid Dynamics (CFD) and the solution of the governing Navier-Stokes conservation equations.

	A Mentor Graphics white paper describes how the choice of the mesh type plays a significant role in user set up time, accuracy of results, and robustness of solution. For the application of CFD for Electronics Cooling applications to be successful there are specific criteria for the meshing approach. Firstly, what mesh is the best for simulation precision? And secondly, what mesh is the best to use for practical applications? The meshing approach should be capable of achieving accurate results but not at the expense of set up time and speed of solution.

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