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The Proper Mesh Can Dictate the Accuracy of Results |
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Posted Thu October 08, 2015 @03:33PM
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Thermal and airflow simulation for electronics cooling thermal design applications presents unique challenges. Typical applications include many surfaces on which boundary layers form, e.g. tops of components, heatsink fins, boards, etc. The most accurate prediction of the pressure and temperature gradients associated with these surfaces is provided by Computational Fluid Dynamics (CFD) and the solution of the governing Navier-Stokes conservation equations.
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