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A Step Change in Electronics Thermal Design
Posted Thu June 20, 2013 @02:14PM
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News As electronics components power density increases alongside packaging and enclosure geometric requirements finding appropriate electronics cooling strategies remains critical.

To further maintain market leading position, beside ensuring thermal design requirements for reliable performance are met, companies must continue to seek out development time savings both in tools, processes and people.

Sponsor CFD Review

Download the complimentary Mentor Graphics white paper A Step Change in Electronics Thermal Design: Incorporating EDA and MDA Design Flows which addresses thermal design issues and process time challenges from concept to final design. It discusses how incorporating electronic design (EDA) and mechanical design flows earlier greatly enhances upfront what-if virtual testing accuracy reducing overall design time and later testing.

A case study of a wall mounted internet box is used to describe an approach bridging design flows from PCB level to enclosure design, using FloTHERM XT, an electronics cooling product.

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