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Gradient, Flomerics Team for Thermal Analysis
Posted Wed June 21, 2006 @09:51AM
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News Flomerics and Gradient Design Automation are partnering to allow chip designers to analyze and avoid temperature-induced electrical issues at the chip level while taking into account the effects of the package and the ambient conditions.

The integrated software solution will be based on product platforms from both companies. Gradient's full-chip thermal analysis tool FireBolt, allows IC designers to access temperature anywhere within a chip and to evaluate how to improve the design with respect to timing, leakages, and reliability, while Flomerics' package-level thermal analysis Flopack tool automates model creation through wizard-driven geometry macros.

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