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| Application: CFD Analysis of a Commercial Plasma Reactor |
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Posted Fri June 22, 2001 @09:29AM
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CFD Canda and CFDRC, in conjunction with KyungWon Tech of Korea, have simulated [pdf file] two commercial high-density plasma reactors of the type used in integrated circuit wafer production. The study concentrated on flow and temperature distribution in the chemical vapor deposition (CVD) process.
In recent years considerable amount of research was devoted to plasma and electromagnetic modeling of process chambers, however thermal aspects were often omitted by assuming constant chamber temperatures. Variation in temperature distribution leads to variation in precursor and intermediate concentrations, which in turn changes surface adsorbtion and surface reaction rates.
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