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Heatsink Designers Turn to Computational Fluid Dynamics
Posted Wed January 18, 2006 @10:19AM
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Application The accelerated release of faster desktop computers being sold at lower prices into the market place has forced thermal engineers to develop and optimize thermal solutions that not only perform better thermally and acoustically, but deliver more value with less weight than previous generations. The continuing reduction in form factor has also increased the challenge placed on today's thermal management designs.

To meet these challenges, Tyco Electronics utilized CFD analysis to optimize both cost and thermal performance of next generation radial folded fin (RFF) heat sinks. This optimized thermal solution approach produced a scalable design capable of meeting the rapidly evolving requirements of the computer market.


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