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Temperature contours on a micro lead frame plastic quad (MLPQ) package in a natural convection chamber with traces modeled for increased accuracy. Image courtesy of ANSYS, Inc.
New Software: ANSYS Icepak 12.0 Released
Posted Wed July 01, 2009 @09:58AM
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News ANSYS, Inc., a global innovator of simulation software and technologies designed to optimize product development processes, today announced the latest release of ANSYSŪ IcepakŪ software, which provides robust and powerful fluid dynamics technology for electronics thermal management.

The 12.0 release introduces new solutions for printed circuit board (PCB) and package thermal analysis, new and enhanced technology for meshing complex geometry, and new physical modeling capabilities.

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