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Temperature and air velocity across circuit board predicted by FLO/PCB.
  
From:
Application: Concurrent Engineering Helps Meet Thermal Challenges of High Speed Design
Posted Mon November 27, 2006 @10:38PM
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Application With each successive generation of Cisco products, increases in functionality and speed have increased thermal design challenges. In response, Cisco Systems has defined a temperature aware design flow that significantly improves co-design between electrical and mechanical engineers.

“The new concurrent electronic/thermal engineering approach has reduced the time required to identify and solve thermal problems, making it practical to address thermal issues at an earlier stage in the design process,” said Herman Chu, Technical Leader for Cisco Systems, San Jose, California. “It appears that the five days that was required in the past to evaluate a prospective board design from a thermal standpoint can be reduced to only two and a half days or less.”

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