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Temperature distribution on an enclosure represented using CAD-shaped geometry.
New Software: New Icepak Offers Enhanced Flexibility and Automation
Posted Wed November 29, 2006 @11:23AM
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News ANSYS, Inc., a global innovator of simulation software and technologies designed to optimize product development processes, today announced the release of version 4.3 of its Icepak(TM) electronics cooling design software.

This version of Icepak introduces key new technologies in the thermal design of electronic systems. Direct representation of CAD geometries expands the ability of Icepak software to handle complex geometry, providing additional flexibility and a higher degree of automation while modeling complex shapes in today's electronics components and systems.

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