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Gradient, Flomerics Team for Thermal Analysis
Posted Wed June 21, 2006 @09:51AM
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News Flomerics and Gradient Design Automation are partnering to allow chip designers to analyze and avoid temperature-induced electrical issues at the chip level while taking into account the effects of the package and the ambient conditions.

The integrated software solution will be based on product platforms from both companies. Gradient's full-chip thermal analysis tool FireBolt, allows IC designers to access temperature anywhere within a chip and to evaluate how to improve the design with respect to timing, leakages, and reliability, while Flomerics' package-level thermal analysis Flopack tool automates model creation through wizard-driven geometry macros.

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New Software: NIKA Introduces Innovative Licensing Model
Posted Wed June 21, 2006 @09:42AM
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News NIKA GmbH, the leading provider of fluid flow and heat transfer simulation software for engineers, today announced the release of EFD.Flexx. EFD.Flexx offers an innovative licensing model for the NIKA Engineering Fluid Dynamics (EFD) product family. The EFD product family consists of EFD.Lab, EFD.V5 for CATIA V5 and EFD.Pro for Pro/ENGINEER. With the addition of EFD.Flexx licensing mechanism, companies employing multi-CAD strategies and or distributed development structures will be able to exchange data internally and with clients or suppliers in various formats.

“The backbone of analysis is data accessibility” said Roland Feldhinkel, NIKA managing director. “With EFD.Flexx, engineers can share resources and conduct fully integrated fluid flow and heat transfer analyses within CATIA V5 and Pro/ENGINEER. Engineers can further supplement their design power and data accessibility by using the company’s sophisticated 3D solid modeler with native direct interfaces to most major CAD packages. With EFD.Flexx users can freely choose the best and most economic way to handle CAD data for their fluid flow simulations and benefit from extensive time and cost savings.”

( Read Full Article | New Software )

ANSYS Joins European @neurIST Project
Posted Fri June 16, 2006 @04:04PM
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News ANSYS, Inc., a global innovator of simulation software and technologies designed to optimize product development processes, today announced ANSYS Europe Ltd.’s participation in the @neurIST project, whose ultimate goal is to provide a new way to understand and manage cerebral aneurysms. ANSYS Europe Ltd., a subsidiary of ANSYS, will work in tandem with other @neurIST partners to collect data, conduct basic and clinical research, develop patient risk assessments and suggest methods for improved treatment protocols and medical devices.

The project, titled Integrated Biomedical Informatics for the Management of Cerebral Aneurysms, is being carried out by a consortium of 29 public and private institutions of 12 European countries. It also includes several organizations from the U.S.A., New Zealand and Japan as external collaborators.

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Free Multiphysics Proceedings CD
Posted Thu June 15, 2006 @01:09PM
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News COMSOL is making available for free a CD that contains all the papers and PowerPoint presentations from its series of Multiphysics User Meetings last fall.

This Proceedings CD has 229 papers, 137 sets of user presentation slides, 44 sets of keynote presentation slides, and even 30 ready-to-run models.

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Business: NIKA GmbH to be Acquired by Flomerics
Posted Thu June 15, 2006 @10:00AM
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News NIKA GmbH, the leading provider of general purpose fluid flow and heat transfer simulation software for engineers, today announced the proposed acquisition by Flomerics Group plc

The companies will merge their businesses and market their combined product portfolio of simulation tools around the world. Flomerics as the market leader in thermal analysis for electronics with its flagship product FLOTHERM has a well established global sales network and will help NIKA to significantly expand sales into countries such as the USA and the UK.

( Read Full Article | Business )

Events: Automotive Preprocessing Enhancements Workshop
Posted Tue June 13, 2006 @07:24AM
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News Fluent Inc. will host a Preprocessing Enhancements Workshop for the Automotive Industry from 10am-2pm on Wednesday, June 28th, 2006 at St. John’s Conference Center in Plymouth, MI.

In addition to improvements in existing tools like prism grows and surface intersection, TGrid 4.0 offers a new surface wrapper tool. The wrapper provides faster turnaround time for meshing (from CAD to volume meshing) in complicated geometry while retaining excellent mesh quality and including more complex geometry details.

Through testing trials for front-end underhood applications, the wrapper, as compared to the traditional method of meshing, has proven to reduce the turnaround time from seven weeks to only one week.

( Post Comment | Events )

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