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| Business: Possible Aquisition of Flomerics
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| Events: Fuel Cell Web Presentations Offered
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Posted Tue October 22, 2002 @10:31AM
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Fluent Inc. invites you to attend two fuel cell web presentations. The presentations can be viewed through any standard web browser, and will last for about 45 minutes. If you are an engineering director or manager; if you are involved in fuel cell research and development; or if you would simply like to see the future of fuel cell development you should attend at least one of these presentations. One webinar will focus on solid-oxide fuel cells (SOFC), the other will focus on polymer electrolyte membrane fuel cells (PEMFC). You are welcome to attend one, or both presentations.
Learn how you can exceed your fuel cell design expectations using FLUENT's robust solver, and FLUENT CFD tools specifically designed for fuel cells. With FLUENT CFD you can model complex simulations such as fluid flow; heat transfer; mass transfer in porous anode and cathode layers, electrochemical reactions, current transport and potential field in porous anode, cathode, and solid conducting regions, and more.
Keynote speakers include: Dr. Randy Gemmen, Department of Energy/National Energy Technology Laboratory; Dr. William Rogers, Department of Energy/National Energy Technology Laboratory; Dr. Ned Djilali, University of Victoria, BC, Dr. Mehrdad Shahnam, Fluent Inc. and Dr. Madhava Syamlal, Fluent Inc.
To register, or for additional information, visit www.fluent.com/direct/fuelcell_webinars/cfdreview.
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Posted Tue October 22, 2002 @09:24AM
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TASPCB is the revolutionary new thermal analysis software for printed circuit
boards from Harvard Thermal. Increasing board densities and higher
power dissipation require an accurate and thorough thermal analysis to insure
the reliability of today's electronics. TASPCB enables companies to
quickly and easily analyze the thermal design of their boards and address
thermal management issues early in the design stage; dramatically reducing
the time and expense of building prototypes.
TASPCB imports all the data from industry recognized ECAD tools and generates
an accurate representation of the board including traces, vias, power and
ground planes and true board shape. Using SmartMapping technology,
TASPCB cross references the data to the built-in component library to generate
accurate 3D representations of the components. Predicting heat transfer
and air flow across the board is accomplished by the integrated CFD solver
developed by Harvard Thermal. The air and the board are automatically
and independently meshed for optimum solution of each domain and optimum
solution speed. Results can be viewed graphically or in tabular format
to identify over temperature-components. Components can be simply drag
and dropped and heat sinks added to solve problems. TASPCB models can be
exported to TAS, Ansys, NASTRAN, and FEMAP for system level analysis.
Harvard Thermal is located in Harvard, Massachusetts. The company provides
cutting edge software solutions for thermal management as well as thermal,
structural and fluid flow consulting services. For additional information
on Harvard Thermal or the other software products and services they offer,
please visit their web site at www.HarvardThermal.com or call (978) 772-3800.
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