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Business: Possible Aquisition of Flomerics
Posted Mon October 28, 2002 @05:40PM
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News The Board of Directors of Flomerics Group PLC has announced that the company has been approached for aquisition, however, no formal offer has come yet and the interested party is unnamed.

Flomerics' flagship product FLOTHERM is a leading thermal analysis package for the electronics industry. FLOTHERM competes directly with IcePak from Fluent Inc.

( Post Comment | Business )


New Software: Amtec Announces Tecplot V9.2
Posted Fri October 25, 2002 @01:24PM
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Post Processing Amtec has announced the release of the latest version of Tecplot, their flagship plotting and visualization software.

Tecplot version 9.2 features significant performance and speed improvements creating a faster, more stable, more intelligent application. New options load data faster, especially with large data sets or multi-zone data. Importing non-standard ASCII data with the new General Text Loader is quick and intuitive.

Other capabilities include support of Mac OS X, as well as several new Add-ons and utilities to solve specific problems.

For more information, view the list of new features in Tecplot 9.2.

( Post Comment | New Software )


Application: CFD Powers Fuel Cell Development
Posted Fri October 25, 2002 @01:20PM
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Application Since the introduction of computational fluid dynamics (CFD) to automotive engineering in the late seventies, this sophisticated technology has developed to become mainstream in almost all areas of vehicle design from aerodynamics to fuel injection. The complex CFD codes developed for these applications are now being applied in the development of fuel cell technology.

In the few years since CFD techniques were first used in fuel cell research, the advances in fuel cell technology have been marked. Nearly all the major automotive manufacturers are developing variants and preparing them for entry into the commercial market. Fuel cell technology is generally regarded as the most promising candidate to replace the internal combustion engine because of its potential for fuel efficiency and cleanliness; hydrogen and oxygen power the cells and they release only water.

( Read Full Article | Application )


Events: Fuel Cell Web Presentations Offered
Posted Tue October 22, 2002 @10:31AM
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ANSYS FLUENT Fluent Inc. invites you to attend two fuel cell web presentations. The presentations can be viewed through any standard web browser, and will last for about 45 minutes. If you are an engineering director or manager; if you are involved in fuel cell research and development; or if you would simply like to see the future of fuel cell development you should attend at least one of these presentations. One webinar will focus on solid-oxide fuel cells (SOFC), the other will focus on polymer electrolyte membrane fuel cells (PEMFC). You are welcome to attend one, or both presentations.

Learn how you can exceed your fuel cell design expectations using FLUENT's robust solver, and FLUENT CFD tools specifically designed for fuel cells. With FLUENT CFD you can model complex simulations such as fluid flow; heat transfer; mass transfer in porous anode and cathode layers, electrochemical reactions, current transport and potential field in porous anode, cathode, and solid conducting regions, and more.

Keynote speakers include: Dr. Randy Gemmen, Department of Energy/National Energy Technology Laboratory; Dr. William Rogers, Department of Energy/National Energy Technology Laboratory; Dr. Ned Djilali, University of Victoria, BC, Dr. Mehrdad Shahnam, Fluent Inc. and Dr. Madhava Syamlal, Fluent Inc.

To register, or for additional information, visit www.fluent.com/direct/fuelcell_webinars/cfdreview.

( Post Comment | Events )


New Software: New Thermal Analysis Tool with 3D CFD
Posted Tue October 22, 2002 @09:24AM
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News TASPCB is the revolutionary new thermal analysis software for printed circuit boards from Harvard Thermal. Increasing board densities and higher power dissipation require an accurate and thorough thermal analysis to insure the reliability of today's electronics. TASPCB enables companies to quickly and easily analyze the thermal design of their boards and address thermal management issues early in the design stage; dramatically reducing the time and expense of building prototypes.

TASPCB imports all the data from industry recognized ECAD tools and generates an accurate representation of the board including traces, vias, power and ground planes and true board shape. Using SmartMapping technology, TASPCB cross references the data to the built-in component library to generate accurate 3D representations of the components. Predicting heat transfer and air flow across the board is accomplished by the integrated CFD solver developed by Harvard Thermal. The air and the board are automatically and independently meshed for optimum solution of each domain and optimum solution speed. Results can be viewed graphically or in tabular format to identify over temperature-components.  Components can be simply drag and dropped and heat sinks added to solve problems. TASPCB models can be exported to TAS, Ansys, NASTRAN, and FEMAP for system level analysis.

Harvard Thermal is located in Harvard, Massachusetts.  The company provides cutting edge software solutions for thermal management as well as thermal, structural and fluid flow consulting services.  For additional information on Harvard Thermal or the other software products and services they offer, please visit their web site at www.HarvardThermal.com or call (978) 772-3800.

( Post Comment | New Software )


New Software: Release of FLOW-3D V8.1
Posted Mon October 21, 2002 @01:56PM
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News Flow Science, Inc. announces the availability of a new upgrade release of its FLOW-3D computational fluid dynamics software. Version 8.1 features multi-processor capability, new models and improvements to existing models, new file compression options, continued advances in the FLOW-VU visualization tool, and a general speed-up in tested calculation speeds.

This release makes available to interested users a version of FLOW-3D that will run on shared memory, multiple processor computers. The implementation is based on OpenMP technology and is available on Windows NT, 2000 and XP, HP-UX, Compaq DEC Alpha and SGI platforms.

( Read Full Article | New Software )


 
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