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Business: Flow Science Announces Consultancy Agreement with Green Twirl Energy
Posted Tue September 01, 2009 @03:55PM
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News Flow Science, Inc. announced today it has entered into a cooperative agreement with Green Twirl Energy Ltd. to provide computational fluid dynamics consultancy services in the alternative fuels, power generation, environmental pollution and water resource engineering industries.

Flow Science, Inc. is a privately-held software company specializing in transient, free-surface flow modeling software for industrial and scientific applications worldwide.

( Read Full Article | Business )


Events: Optimize Chassis, Venting and Airflow Design in Electronics Enclosures
Posted Tue September 01, 2009 @03:52PM
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Announcements During this complimentary 45-minute Mentor Graphics presentation, we will show you how simulation can help you optimize airflow and resolve heat transfer issues inside electronics enclosures.

Wednesday, September 16
11:00 am US/Pacific
or
Tuesday, September 17
10:00 am UK/London Time

( Read Full Article | Events )


Application: PowerJet SaM146 Fan Efficiency Optimization
Posted Tue September 01, 2009 @08:19AM
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Application Sigma Technology has used IOSO technology to optimize the efficiency [pdf] of the PowerJet SaM146 transonic fan.

To solve the problem, a 3D CFD code and multilevel IOSO technology was used. The search for the optimum design was carried out in the multi-objective statement (the compromise between the efficiency levels for core and bypass contours was searched).

( Post Comment | Application )


New Software: ANSYS Launches Immersed Boundary Module
Posted Mon August 31, 2009 @10:03AM
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ANSYS ANSYS, Inc., a global innovator of simulation software and technologies designed to optimize product development processes, today announced the availability of the Immersed Boundary module for ANSYS(R) FLUENT(R) 12.0 software.

Jointly developed by ANSYS and long-time partner Cascade Technologies Inc., the module dramatically reduces the amount of time needed for fluid flow simulations and provides fast results by directly addressing challenges associated with meshing.

( Read Full Article | New Software )


Events: Metacomp Technologies User Group Meeting
Posted Mon August 24, 2009 @04:44PM
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Announcements Metacomp Technologies is pleased to announce our User Group Meeting / Workshop to be held in Ventura, CA, Sep 15–17, 2009.

The meeting will comprise presentations by users and Metacomp staff and the workshop will include seminars on advanced topics related to CFD++, CAA++, MIME and CSM++.

( Read Full Article | Events )


New Software: Coolit V.9 Released
Posted Mon August 24, 2009 @04:41PM
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News Coolit v.9 thermal & flow analysis software dramatically shortens modeling time for engineers simulating complex electronics. The user can now build complex IC chip models, using either model constructors which guide you from start to finish, or create them from scratch using basic Coolit building blocks, or pick them ready to go from the expanded IC Package library.

( Read Full Article | New Software )


 
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