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New Software: New Icepak Offers Enhanced Flexibility and Automation
Posted Wed November 29, 2006 @11:23AM
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News ANSYS, Inc., a global innovator of simulation software and technologies designed to optimize product development processes, today announced the release of version 4.3 of its Icepak(TM) electronics cooling design software.

This version of Icepak introduces key new technologies in the thermal design of electronic systems. Direct representation of CAD geometries expands the ability of Icepak software to handle complex geometry, providing additional flexibility and a higher degree of automation while modeling complex shapes in today's electronics components and systems.

( Read Full Article | New Software )


New Software: Tecplot Announces Tecplot 360 2006 Release 2
Posted Wed November 29, 2006 @09:08AM
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News Tecplot, Inc., a developer of data visualization and technical plotting software, today announced the immediate availability of Tecplot 360 2006 Release 2.

Tecplot 360 is the company’s flagship data visualization product. It is complete CFD visualization and post-processing software with extensive XY, 2D and 3D capabilities for engineers visualizing data from analyses, simulations and experiments.

( Read Full Article | New Software )


Events: Computational Flow Dynamics, Microfluidics and Applications Seminar
Posted Mon November 27, 2006 @10:46PM
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Announcements Ozen Engineering, Inc. will deliver an applied CFD seminar on December 2nd at Santa Clara University in Santa Clara, California.

Ozen Engineering, technical leaders in the CFD simulation field, will share the technology and its applications in different industries. The intended audience of this seminar is engineers and managers who are developing understanding of applied CFD and use of commercially available software tools.

( Read Full Article | Events )


Application: Concurrent Engineering Helps Meet Thermal Challenges of High Speed Design
Posted Mon November 27, 2006 @10:38PM
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Application With each successive generation of Cisco products, increases in functionality and speed have increased thermal design challenges. In response, Cisco Systems has defined a temperature aware design flow that significantly improves co-design between electrical and mechanical engineers.

“The new concurrent electronic/thermal engineering approach has reduced the time required to identify and solve thermal problems, making it practical to address thermal issues at an earlier stage in the design process,” said Herman Chu, Technical Leader for Cisco Systems, San Jose, California. “It appears that the five days that was required in the past to evaluate a prospective board design from a thermal standpoint can be reduced to only two and a half days or less.”

( Read Full Article | Application )


Events: International Oil and Gas CFD Conference
Posted Thu November 23, 2006 @12:27PM
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Announcements There is now less than two weeks left to register before the International Oil and Gas CFD Conference opens in London on November 30th, the first event of its kind to be held in the UK.

A final agenda has been announced highlighting an impressive array of keynote speakers from industry leading global companies including Shell, BP, Halliburton, NATCO, EniTechnologie, and Pluere. The IOCC will be one of the single biggest gatherings of CFD industry practitioners within the Oil and Gas and Petrochemical industries, ever.

( Read Full Article | Events )


New Software: CFdesign V9 - A Faster Way from MCAD to Solutions
Posted Wed November 22, 2006 @05:56PM
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CFdesign CFdesign V9 Upfront CFD software from Blue Ridge Numerics enables engineers to set up and view first-pass fluid flow and heat transfer simulations in minutes while generating high-fidelity design reviews up to 20 times faster than with previous versions. Developed for multi-tasking mechanical, electro-mechanical, and thermal engineers, V9 also offers new analysis features to increase innovation during new product development.

“The two greatest requirements among engineers in our marketplace are speed and innovation,” says Ed Williams, president of Blue Ridge Numerics. “There is no other CFD package on the market that allows an engineer to go from 3D concept to an innovative, production-ready design as quickly and efficiently as CFdesign V9.”

( Read Full Article | New Software )


 
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