The project, titled Integrated Biomedical Informatics for the Management of Cerebral Aneurysms, is being carried out by a consortium of 29 public and private institutions of 12 European countries. It also includes several organizations from the U.S.A., New Zealand and Japan as external collaborators.

This Proceedings CD has 229 papers, 137 sets of user presentation slides, 44 sets of keynote presentation slides, and even 30 ready-to-run models.

The companies will merge their businesses and market their combined product portfolio of simulation tools around the world. Flomerics as the market leader in thermal analysis for electronics with its flagship product FLOTHERM has a well established global sales network and will help NIKA to significantly expand sales into countries such as the USA and the UK.

In addition to improvements in existing tools like prism grows and surface intersection, TGrid 4.0 offers a new surface wrapper tool. The wrapper provides faster turnaround time for meshing (from CAD to volume meshing) in complicated geometry while retaining excellent mesh quality and including more complex geometry details.

Through testing trials for front-end underhood applications, the wrapper, as compared to the traditional method of meshing, has proven to reduce the turnaround time from seven weeks to only one week.

On the ProE-03 viewset from Spec ViewPerf 8.10, the V7350 produced a weighted geometric mean score of 58.32. Although these are not the highest scores I've seen on these benchmarks, they are respectable. If you have large or particularly complex models that can take advantage of the 1GB of memory on the V7350, you'll likely see significant performance benefits.

The ATI FireGL V7350 carries an MSRP of $1,999.

V2.0 also delivers the ability to handle transient flow, which augments the software's existing capabilities to test for standard JEDEC forced, free convection, slots as well as custom setups. CoolitPCB also reports component junction temperature, case temperature, as well as detailed 3D airflow and temperature distribution.