AMD has announced the latest additions to the award-winning AMD Opteron™ processor family — Models 852 and 252. The new models represent the world’s highest performing processors for one-way to eight-way x86 servers and workstations.

To enable OEMs and system builders to take advantage of the next generation of I/O technology, AMD also announced the AMD-8132™ HyperTransport™ PCI-X® 2.0 tunnel, scheduled to ship for servers and workstations this month. The latest addition to the AMD-8000™ series of chipsets, the AMD-8132 tunnel brings high-performance PCI-X 2.0 connectivity to AMD Opteron processor-based systems with increased throughput, improved RAS capabilities, robust data management and enhanced HyperTransport technology connectivity.

HP has announced industry firsts from a major vendor for customers in computing manageability, performance and choice with the introduction of new products and solutions that harness the power of the industry's latest processor technology.

Introduced at LinuxWorld, the new HP BladeSystem server blades, an HP workstation that supports new dual-PCI Express graphics solutions, and a new high-performance, enterprise-class HP ProLiant server are all based on the latest AMD Opteron™ processors that deliver more compute power for customers' demanding x86 applications.

I would like to have the complete mass, momentum and energy equations with proper connectivity between adjacent subchannels. If there is any commercial CFD software available (my problem involves phase change), please let me know."

Icechip is an addition to the portfolio of design simulation and verification tools from the Icepak division of Fluent Inc. These include Icepak, the system-level thermal design tool; Iceboard, the PCB-level thermal verification software; and Icemax, the parasitics extraction tool for IC packages. Icechip is designed to increase the fidelity of package thermal design by modeling details of IC package structures and it significantly reduces the turnaround time for simulations of today’s increasingly complex IC packages. The tool is developed in collaboration with Harvard Thermal, the industry expert in the use of ECAD-based interfaces to thermal simulation software.

Join us at one or both of our half-day free awareness seminars on March 9th in Manchester, UK if you are new to fluid modelling or are you looking to improve your CFD meshing or simulation solutions.

This free webinar will give you the chance to see some of the exciting new features and functionality in the pending release of FLUENT 6.2, the latest version of our flagship product.

The webinar will last for one-hour with a question and answer session at the end of the presentation.