"Century Dynamics' focus on ease-of-use is very much aligned with our focus, only in a completely parallel technology," said Jim Cashman, president and CEO at ANSYS, Inc. "This acquisition is attractive to customers, stockholders and employees for its advanced technology, growth potential and market presence. We believe that by aligning our global sales and marketing resources with Century Dynamics' outstanding technology, we will continue to deliver a more complete and comprehensive solution to our customers."

I am an undergraduate student writing a CFD code for simple physics. I have a set of equations which are NOT tridiagonal. So I think I can use ADI method. I am programming in the C++ language. Can anyone mail me C++ code for solving N*N matices using ADI method?

Thanks,
Dilip
email: dilip441@yahoo.co.in

"ALGOR V16.1's parametric, structured meshing tools allow me to conveniently and quickly modify a structured mesh when working with complex, 3-D models," said Bill King of in-Finite Solutions, Inc. in Eagle, Idaho. "This provides a significant time savings when modifying hand-built FEA models."

The Mac port was strongly motivated by NASA customers who have begun using Macs for CFD meshing, postprocessing, and visualization. Mac OS X and Xserve provide a powerful and productive environment to handle the compute-intensive tasks and support workgroup data needs, while the Power Mac G5 is a desktop machine that people enjoy working with.

Dr. Craig Hunter, a CFD researcher in the Configuration Aerodynamics Branch at NASA Langley Research Center, has this to say about Gridgen and the Mac: "I look forward to Gridgen filling that critical need as a preprocessor tool, and enabling us to more effectively use our numerous structured grid flow solvers and other CFD tools on Mac OS X."

“Icepak division of Fluent is focused on delivering the best-in-class suite of design tools to the electronics industry” says Prabhu Sathyamurthy, Director of Icepak division. “This partnership between Fluent and Harvard Thermal will benefit customers seeking detailed thermal design of IC packages, which are becoming increasingly complex in functionality and layout. Icechip is designed to perform detailed thermal analysis inclusive of IC package substrates, traces, vias, non-uniform heat generation, wire bonds, and solder balls. It will also be able to handle all varieties of IC package types including wirebond and flipchip BGAs, stacked die configurations, and Multi-Chip Modules (MCMs).”