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CFD News by Email |
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Just log in and select Email Headlines Each Night on your User Preferences page.
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Posted Mon July 02, 2001 @08:54AM
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The 2001 Fluent Automotive Users' Group Meeting will be held July 24-25 in Novi, Michigan.
The agenda includes, Fluent product reports (including the modeling advances to be released in Fluent V6), user presentations, discussions on modeling external aerodynamics, underhood thermal management, acoustics, multiphase, and powertrain applications, and on-site training in modeling turbulence and turbomachinery.
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| AEA Technology Appoints New CEO for CFX |
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Posted Fri June 29, 2001 @08:07AM
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AEA Technology has announced the appointment of Chris Reid as President and CEO of the CFX division. His primary objective will be to build
further on an already successful company, deliver significant growth and focus on business process improvement.
With 22 years of global experience in a variety of senior management positions, including sales, marketing and product development, Chris is highly qualified to take on the senior executive position. His appointment is an indication of CFX's long term commitment to its business, and to its customers worldwide.
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| AEROSOFT Releases GASP V4 |
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Posted Wed June 27, 2001 @08:14AM
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AEROSOFT
has released Version 4 of their GASP flow solver.
New features include:
- Totally Redesigned Interface
- Support for Chimera/Overset Grids (with Hole-Cutting and Stencil Selection)
- Dual Time-Stepping Time-Accurate Formulation
- 6-DOF Models for Multiple Moving Body Simulation
- MPI Parallel Formulation
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| Preview of CFD-ACE+ Version 6.6 |
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| IBM Delivers World's 2nd Fastest Computer |
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Posted Fri June 22, 2001 @10:11AM
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IBM has delivered the world's second fastest computer (and the world's fastest unclassified computer) to the National Energy Research Scientific Computing Center (NERSC). The machine, second only to IBM's own ASCI White computer, will be used for modeling internal combustion engines, global climate change, and developing new materials.
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| Application: CFD Analysis of a Commercial Plasma Reactor |
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Posted Fri June 22, 2001 @09:29AM
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CFD Canda and CFDRC, in conjunction with KyungWon Tech of Korea, have simulated [pdf file] two commercial high-density plasma reactors of the type used in integrated circuit wafer production. The study concentrated on flow and temperature distribution in the chemical vapor deposition (CVD) process.
In recent years considerable amount of research was devoted to plasma and electromagnetic modeling of process chambers, however thermal aspects were often omitted by assuming constant chamber temperatures. Variation in temperature distribution leads to variation in precursor and intermediate concentrations, which in turn changes surface adsorbtion and surface reaction rates.
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