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Events: Optimizing the Extrusion and Die Design Process
Posted Tue February 12, 2019 @05:34PM
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Announcements Siemens PLM will host the live webinar Using the Viscous & Viscoelastic Solvers in Simcenter STAR-CCM+ in the Extrusion Process on February 27th.

Learn how simulation and design exploration tools from Siemens PLM Software are used to simulate and optimize the extrusion and die design process for producing polymeric and plastic parts, minimizing the required energy and raw materials.

( Read Full Article | Events )


ANSYS Cloud Delivers Easy HPC
Posted Mon February 11, 2019 @05:57PM
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News In collaboration with Microsoft Azure, ANSYS has developed and launched an all-new cloud offering ANSYS Cloud.

Engineering simulation has long been constrained by fixed computing resources available on a desktop or cluster. Today, however, cloud computing can deliver the on-demand, high performance computing (HPC) capacity required for faster high-fidelity results offering greater performance insight.

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Events: How to Use CFD for Electronics Cooling
Posted Mon February 11, 2019 @05:16PM
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Announcements SimScale will host How to Use CFD for Electronics Cooling on February 19th.

When it comes to electronics, neglecting to effectively cool a component within a system can lead to overheating, product lifespan reduction, and even operational failure. Using fluid flow simulation (CFD), key metrics such as junction temperatures, energy consumption, energy removed and the path the heat takes out of the domain can be evaluated.

( Read Full Article | Events )