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Events: Optimizing the Extrusion and Die Design Process
Learn how simulation and design exploration tools from Siemens PLM Software are used to simulate and optimize the extrusion and die design process for producing polymeric and plastic parts, minimizing the required energy and raw materials.
Engineering simulation has long been constrained by fixed computing resources available on a desktop or cluster. Today, however, cloud computing can deliver the on-demand, high performance computing (HPC) capacity required for faster high-fidelity results offering greater performance insight.
When it comes to electronics, neglecting to effectively cool a component within a system can lead to overheating, product lifespan reduction, and even operational failure. Using fluid flow simulation (CFD), key metrics such as junction temperatures, energy consumption, energy removed and the path the heat takes out of the domain can be evaluated.