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Practical Structural & Thermal Management of Electronic & Electro-Mechanical Products
Posted Fri April 17, 2015 @05:40PM
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Announcements Join Wilde Analysis on Wednesday 29th April as we showcase ANSYS' multiphysics capabilities, combining electromagnetic, thermal and structural simulation, relevant to electronics design.

Understanding the thermal behaviour and associated structural response of a component is crucial to the design of an electronics product. From initial concept through to manufacturing, ANSYS simulation plays its part in helping engineers eliminate under-performing proposals, while also providing non-invasive methods for performance assessments of potential designs.

Sponsor CFD Review

Join us for this 45-minute webinar covering:
  • Thermal analysis
  • Joule / resistive heating
  • Transient heat-up and cool-down
  • Structural response
  • Thermal induced stresses and deformations
  • High Acceleration, Shock and Impact Loadings
  • Multiphysics analysis coupling electromagnetics simulation, CFD and FEA - including the leading ANSYS Maxwell, Icepak, and Mechanical solvers
  • Model parameterisation for geometric dimensions and operational conditions
  • Modelling of fans, heat sinks, fins and other components within an electronics assembly
  • Integration with external CAD

To register, or for further information, please visit: -for-thermal-and-structural-response-of-electronic -components

Alternatively, please contact us on 0161 474 7479 or email

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